中文摘要：

为了评估相变储能式散热技术在间歇式大功率电子器件热管理中的适用性，本文采用实验方法研究了在短时大功率（60-120W）较高热流密度（5．3～10．5W·cm^-2）加热条件下相变储能式热沉的瞬态性能。实验结果表明，在不同的加热功率下，采用相变储能式热沉可以将冷却目标的温升最多降低约40℃，而其平均等效热阻能比传统热沉降低30％以上，体现了明显的性能优势。此外，通过添加翅片的方法可以进一步改善相变储能式热沉的性能。如果设定电子器件正常的工作温度为80℃，有翅片的热沉能将有效保护时间延长多达130％。在大功率短时加热条件下，采用相变储能式热沉能够达到理想的散热效果，而通过强化传热手段可以进一步优化其性能。

英文摘要：

To assess the feasibility of phase change-based heat sinks for thermal management of high-power electronics under intermittent operation, an experimental study of the transient perfor- mance of a phase change-based heat sink was performed with high-power pulsed heating （60-120 W） at relatively high heat fluxes （5.3-10.5 W·cm^-2）. Under different heating powers, the results showed that the phase change-based heat sink could lower the temperature of the cooling target as much as 40℃, and that average effective thermal resistance could be smaller than that of the traditional heat sink by 30%, suggesting the advantage of using the phase change-based heat sink. In addition, introduction of fins could further improve the performance of the phase change-based heat sink. If the operation temperature of electronics is set at 80℃, the protection time period could be increased by 130% for the finned case. Under the high-power pulsed heating condition, ideal cooling performance could be achieved by use of a phase change-based heat sink, and its performance could be further improved by heat transfer enhancement.