中文摘要：

聚酰亚胺一银的复合薄膜以其表面银层无与伦比的反射性和电导率，再加上聚酰亚胺基体本身优异的热稳定性和物理机械性能，以及其轻质和柔性的特点，在航空航天和微电子等许多领域具有广阔的应用前景，成为近年来广泛研究的多功能材料之一。本文对比了当前用于制备表面金属化的聚酰亚胺薄膜的各种方法及其优缺点，包括外部沉降法、超临界流体法、原位一步自金属化法、表面改性离子交换自金属化法和直接离子交换自金属化法，特别总结了由本课题组近年来所发展起来的表面改性离子交换自金属化法和直接离子交换自金属化法在制备高反射高导电的双面银化的聚酰亚胺薄膜方面所取得的研究进展。这两种方法均基于简单的银盐化合物前驱体即可实现双面高反射高导电的表面银化的聚酰亚胺薄膜的制备，过程简单，成本低廉。所制得的聚酰亚胺一银复合薄膜的表面反射率超过100％，表面电阻接近纯金属银的水平；复合薄膜的表面银层与聚合物基体之间有很优异的粘结性能；且很好地保持了母体聚酰亚胺薄膜优异的机械性能和热性能。其中采用直接离子交换自金属化技术，仅需将聚酰亚胺的预聚体薄膜在极稀的银盐水溶液中（0．01M银氨溶液）处理5min，然后热处理即可实现聚酰亚胺薄膜的双面金属化，是目前效率最高和银利用率最高的方法。

英文摘要：

Surface-silvered polyimide （PI） film, due to the combination of the excellent thermal and mechanical properties of the polyimide matrix and the unmatched optical reflectivity and electrical conductivity of the surface silver （Ag） layer as well as as its light weight and flexibility, has been found widely attractive in a＇erospace and microelectronic industry and therefore has been extensively studied in recent years. In this review, we described the currently-used main techniques that were developed for the preparation of surface-metallized polyimide films, including external deposition, supercritical fluid impregnation, in-situ single-stage self-metallization, surface-modification ion-exchange self- metallization and direct ion-exchange self-metallization methods, and compared their advantages and disadvantages for producing the metallized polymer films. Particularly, the progress in the preparation of highly reflective and conductive surface-silvered polyimide films via the surface-modification ionexchange self-metallization technique and direct ion-exchange self-metallization technique, both of which were developed in our groups, was summarized. With these two methods, double-surfacesilvered polyimide films with high surface reflectivity and conductivity were produced by employing simple silver compounds as the silver precursor, which possess the advantages of processing simplicity and considerably reduced cost. Moreover, the finally-obtained polyimide-silver composite films were prepared with surface reflectivity over 100% and surface conductivity comparable to native silver metal. Excellent interfacial adhesion between the surface silver layer and the polyimide substrate was realized and the surface-metallized hybrid films basically maintain the essential thermal and mechanical properties of the parent polyimide. Especially, it should be emphasized that, with the direct ionexchange self-metallization procedure, double-surface-silvered polyimide films could be realized by employing an aqueous silver