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中文摘要：
由于其良好的抗氧化性、热稳定性及高电导性，核壳结构铜-银包覆粉在电子浆料、导电填料等众多领域具有广阔的应用前景。总结归纳了化学还原法制备核壳结构铜-银包覆粉的研究进展，重点介绍了直接置换法和还原剂还原两种方法的制备工艺、机理及研究结果。分析表明：包覆过程中铜粉的性能、温度、搅拌速度等因素对最终包覆产品的性能有较大影响；铜粉的氧化、包覆时的水解及银盐利用率低等问题是制约核壳结构铜-银包覆粉制备的关键问题。据此提出了相应的解决措施，并对今后的研究应用方向进行了展望，为进一步深入研究奠定了基础。
英文摘要：
The core-shell Cu-Ag coated powder has a wideapplication in electronic slurry, conductive filler and other fields because of its good oxidation resistance, thermal stability and high conductivity. In this paper the research progress in the preparation of the core-shell structure copper-silver coated powder by chemical reduction is summarized, and the preparation technology, mechanism and research results of direct substitution method and reduction method are mainly introduced. It is shown that the copper＇s character, temperature, stirring speed and so on, have a great impact on the product performance, while the oxidation of copper, the hydrolysis and the low utilization rate of silver salt et al, are the key issues that restrict the preparation of the core-shell structure Cu-Ag coated powder. Some solving measures are also presented in view of the existing problems; the research and application tendency in future is also prospected, to lay a foundation for further study.
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