碟轮修整方法可以实现对单层钎焊金刚石砂轮的精密修整,改善磨粒等高性,提高加工表面质量.为了探究此种修整方法对磨削SiC陶瓷的材料去除机理的影响,建立了砂轮修整量与单颗磨粒最大切厚之间影响关系的理论模型,并且进行了单层钎焊金刚石砂轮的碟轮修整实验,在修整过程中又进行了SiC陶瓷的磨削实验.从砂轮磨粒形貌及磨削表面形貌角度对磨削过程中的材料去除机理进行了研究.结果表明,碟轮修整单层钎焊金刚石砂轮增加了砂轮表面动态有效磨粒数,减小了单颗磨粒最大切厚,使SiC陶瓷的材料去除方式从修整前的脆性断裂转变为塑性变形,最终实现了SiC陶瓷的延性域磨削.
Monolayer brazed diamond wheel can be precisely dressed by the plate wheel dressing method.The contour of grits is improved and the quality of the ground surface is enhanced.In order to investigate the influence of the dressing method on the material removal mechanism,a theoretical model about the influence of the dressing depth on the maximum undeformed chip thickness is proposed.Besides,a monolayer brazed diamond wheel is dressed through plate wheel dressing.During the dressing procedure,a serial of grinding experiments are carried out on SiC ceramics.The material removal mechanism of the ground surface on SiC ceramics is studied in terms of the morphologies of grits and the ground surfaces.The results show that the number of the dynamic effective grits on the diamond wheel is increased when dressing the monolayer brazed diamond wheel with the plate wheel,leading to the decrease of the maximum undeformed chip thickness.The material removal mode changes from brittle rupture to plastic deformation.The ductile-regime grinding of SiC ceramics is realized finally.