中文摘要：

三维（3-Dimension）芯片结构由于有着高密度、高速率、低功耗等优点而逐渐成为超大规模集成电路技术中的热门研究方向之一，在3D结构中通过使用硅通孔来连接垂直方向上的不同模块单元。但TSV在生产过程中会出现部分失效，导致整个芯片的失效。鉴于此，提出了多链式可配置容错结构，通过配置交叉开关单元，将TSV链与增加的冗余TSV导通的方法实现失效TSV的修复。实验表明整体修复率可以达到99％以上，同时面积开销和传输延迟也较低。

英文摘要：

Owing to high density, high frequency and low power,3-Dimension（3D） chip structure is becoming one of the most popular academic research field in Very Large Scale Integrated Circuits（VLSI）. Vertical Through-Silicon-Vias （TSV） structure is used to connect vertical modules units. But in the production process, parts of them will be fail, this will lead to the whole chip can not work normally. Therefore, a configurable fault-tolerant structure with multiple TSV chain is presented. By configuring the switch unit, the TSV chain with failure TSV would be connected to the redundant TSV then resume the chip. The experiment results show that the overall chip recovery rate can reach to more than 99%, meanwhile the area overhead and the signal delay are both lower.