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Study on the Near Field Characteristic of Antenna-in-Package
  • 期刊名称：IEEE Transactions Components, Packaging and Manufa
  • 时间：2012.9.1
  • 页码：1449-1454
  • 相关项目：双频段差分微带天线的建模与封装性能研究
作者： Xinwei Chen|Yanfeng Geng|Yi Zhang|Wenmei Zhang|
同期刊论文项目
双频段差分微带天线的建模与封装性能研究
期刊论文 22 会议论文 7
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