中文摘要：

通过非等温示差扫描量热分析（DSC）,热重分析（TGA）及物理力学性能测试研究了分别以双氰胺、二氨基二苯基砜、线形酚醛树脂为固化剂,2-甲基咪唑为固化促进剂的环氧树脂体系的固化行为,热稳定性及其粉末涂料性能,并利用外推法求出不同固化体系的理论固化温度。结果表明：双氰胺/2-甲基咪唑体系的综合性能最好,其理论固化温度为142℃,热失重起始分解温度为410℃,冲击强度为50 cm,60°光泽为83,表面电阻为1.33×1012Ω。

英文摘要：

The curing behavior,thermal stability of the epoxy systems using dicyandiamide,diamino diphenyl sulfone and linear phenolic resin as curing agent respectively and 2-methylimidazole as curing accelerator and the properties of the epoxy power coatings prepared from them were investigated by DSC,TGA analysis and the mechanical property tests.The theoretic curing temperature of different curing systems was calculated using extrapolation methods.The results showed that the comprehensive properties of dicyandiamide/2-methylimidazole systems was the best and the values were as followed ： theoretic curing temperature 142 ℃,initial decomposition temperature 410 ℃,impact resistant 50 cm,luster at 60°83,surface resistance 1.33×1012Ω.