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Study on Dynamic Failure model of lead-free solders using SHPB techniques
  • ISSN号：0217-9792
  • 期刊名称：International Journal of Modern Physics B
  • 时间：0
  • 页码：1117-1122
  • 语言：英文
  • 相关项目：无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
作者： xiaoyan Niu,Guozheng Yuan, Zhigang Li, Xuefeng Shu|
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无铅焊料电子封装芯片动力失效模式及相关力学问题的实验与理论研究
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