中文摘要：

针对半导体晶圆制造中设备众多,生产周期长和多次重入等特点,提出一种在制品水平分解控制方法。首先,通过仿真实验,依据系统关键指标受设备性能变化影响的灵敏度大小,确定设备的约束权重;然后,依据设备约束权重,结合产品的加工参数,确定每种产品各加工阶段合理的在制品水平分布;最后,设备依据实际在制品水平和目标在制品水平的差别和上下游信息,动态地选择工件加工。通过仿真实验,验证了算法的可行性和有效性。

英文摘要：

A Work in Process（WlP）controlling approach was proposed to cope with the complication of wafer fabrication, such as large number of equipments, long cycle time and reentering process flow. Firstly, through simulation experiment, each machine＇s constraint weight was defined by the sensitivity of the system＇s performance to the sys- tem key index. Then the target cycle time and WIP level was allocated into each process step according to the related machine＇s constraint weight and machining parameters. Finally, part was dynamically selected to be processed based on the difference between the target and actual WIP level and the upstream/downstream information. A simulation experiment was presented to illustrate the feasibility and effectiveness of this method.