中文摘要：

探讨了光固化树脂磨具不同于普通树脂磨具的结合机理，并在该理论的基础上寻找出改善磨具结合性能的措施。首次在光固化树脂结合剂锯片中引进几种金属镀覆的金刚石磨料，通过对不同半导体材料进行切割试验，证实了在光固化树脂结合剂锯片中采用金属镀覆金刚石磨料后，针对单晶硅、铌酸锂、陶瓷等半导体材料，几种不同锯片的磨损率分别降低了259／5～200％、12．5％～62．5％和10．5%～52．6％，加工效率和使用寿命有了显著的提高。

英文摘要：

This paper firstly studied the bonding mechanism of the photosensitive resin blade, and then introduced the effective measures to improve the quality for photosensitive resin blade by means of the metal-coated diamond abrasive and studied the change of bonding ability of the blade compared with conventional abrasive. It has been verified through the SEM photos of blade and the dicing test that the gripping strength between metal-coated abrasive and resin increases greatly. The wear rate of the blades is decreased wariously from 10% to 200% due to different coating materials and different dicing materials.