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Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Usi
  • ISSN号：1345-9678
  • 期刊名称：Materials Transactions
  • 时间：2013.6.6
  • 页码：872-878
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Mu, Fengwen|Zhao, Zhenyu|Zou, Guisheng|Bai, Hailin|Wu, Aiping|Liu, Lei|Zhang, Dongyue|Zhou, Y. Norman|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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