提出基于散热弱度的材料微结构热传导性能的预测方法,分别从理论和数值上验证该方法与均匀化方法的等效性;推导出微结构等效热传导系数的灵敏度计算格式,建立传热微结构拓扑优化的数学模型.以二维、三维多相材料等效热传导系数的加权组合为目标,采用凸规划对偶优化算法和二次型周长约束进行材料微结构的设计和材料分布的棋盘格控制.数值算例表明基于散热弱度的传热材料微结构设计是可行、有效的,可以为实际的材料设计提供依据.
In this paper,a new method based on the heat dissipation of microstructure is proposed to predict the thermal conductivity of the material microstructure.This method is shown to be equivalent to the homogenization method both theoretically and numerically.Based on the finite element discretization of the microstructure,the sensitivity analysis for the effective thermal conductivity is carried out and the topology optimization model of the heat-conducting microstructure is built to maximize the different combinations of effective thermal conductivity coefficients related to 2D and 3D multiphase materials.The dual optimization scheme and the quadratic perimeter constraint are used to solve the problem and to control the checkerboard pattern during optimization procedure.Numerical examples show that the design of the microstructure using the heat dissipation is effective and can provide satisfactory design results with respect to material microstructures.