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Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by ato
  • ISSN号：0169-4332
  • 期刊名称：Applied Surface Science
  • 时间：2015.1.1
  • 页码：464-474
  • 相关项目：广义位错与纳米显微结构温度依赖相互作用机理研究
作者： Li, Jia|Fang, Qihong|Zhang, Liangchi|Liu, Youwen|
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