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Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Densit
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2013.8.8
  • 页码：2641-2647
  • 相关项目：Sn-Zn基和Sn-Cu-Bi无铅焊球凸点互连电迁移行为及其失效机理研究
作者： Sa, Xianzhang|Wu, Ping|
同期刊论文项目
Sn-Zn基和Sn-Cu-Bi无铅焊球凸点互连电迁移行为及其失效机理研究
期刊论文 15 会议论文 1
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