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Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits
  • ISSN号：0026-2692
  • 期刊名称：Microelectronics Journal
  • 时间：0
  • 页码：128-133
  • 相关项目：非标准逻辑数字电路的衬底噪声建模及验证技术研究
作者： Qian, Libo|Zhu, Zhangming|Yang, Yintang|
同期刊论文项目
非标准逻辑数字电路的衬底噪声建模及验证技术研究
期刊论文 53
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