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Evaporation Erosion During the Relay Contact Breaking Process Based on a Simplified Arc Model
  • ISSN号:1009-0630
  • 期刊名称:《等离子体科学与技术:英文版》
  • 分类:TM58[电气工程—电器] TU528.01[建筑科学—建筑技术科学]
  • 作者机构:School of Electrical Engineering and Automation, Harbin Institute of Technology,Harbin 150001, China
  • 相关基金:supported by National Natural Science Foundation of China (Nos. 51377038, 51307030)
中文摘要:

Evaporation erosion of the contacts is one of the fundamental failure mechanisms for relays.In this paper,the evaporation erosion characteristics are investigated for the copper contact pair breaking a resistive direct current(dc) 30 V/10 A circuit in the air.Molten pool simulation of the contacts is coupled with the gas dynamics to calculate the evaporation rate.A simplified arc model is constructed to obtain the contact voltage and current variations with time for the prediction of the current density and the heat flux distributions flowing from the arc into the contacts.The evaporation rate and mass variations with time during the breaking process are presented.Experiments are carried out to verify the simulation results.

英文摘要:

Evaporation erosion of the contacts is one of the fundamental failure mechanisms for relays. In this paper, the evaporation erosion characteristics are investigated for the copper contact pair breaking a resistive direct current (dc) 30 V/10 A circuit in the air. Molten pool simulation of the contacts is coupled with the gas dynamics to calculate the evaporation rate. A simplified arc model is constructed to obtain the contact voltage and current variations with time for the prediction of the current density and the heat flux distributions flowing from the arc into the contacts. The evaporation rate and mass variations with time during the breaking process are presented. Experiments are carried out to verify the simulation results.

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期刊信息
  • 《等离子体科学与技术:英文版》
  • 主管单位:中国科学院 中国科协
  • 主办单位:中国科学院等离子体物理研究所 中国力学学会
  • 主编:万元熙、谢纪康
  • 地址:合肥市1126信箱
  • 邮编:230031
  • 邮箱:pst@ipp.ac.cn
  • 电话:0551-5591617 5591388
  • 国际标准刊号:ISSN:1009-0630
  • 国内统一刊号:ISSN:34-1187/TL
  • 邮发代号:
  • 获奖情况:
  • 国内外数据库收录:
  • 美国化学文摘(网络版),荷兰文摘与引文数据库,美国工程索引,美国剑桥科学文摘,美国科学引文索引(扩展库),英国科学文摘数据库
  • 被引量:89