为了防止芯片过热,提高芯片可靠性和稳定性,提出了一种改进的高精度、低功耗、具有迟滞功能且结构简单的过温保护电路。在不引入热振荡的前提下,实现稳定电路温度和输出关断信号的双重功能。阐述了过温保护电路的工作原理,基于先锋国际半导体公司的BiCMOS0.5μm工艺库模型进行电路设计,采用Hspice软件并用先锋国际半导体公司的BiCMOS 0.5μm工艺库模型对该电路进行模拟仿真。仿真结果表明:当外界温度达到137℃时,过温保护电路输出发生翻转,从而关断芯片内的其他电路,降低功耗,使温度降低。当温度降到120℃时,芯片回到正常工作状态,温度迟滞量为17℃,性能稳定可靠。
To avoid overheating and improve the reliability and stability of the chip, an improved thermal protection circuit with high precision, low power consumption, the function of hysteresis and simple structure is presented. The circuit was optimized to implement the dual functions of keeping stable temperature and outputting shut-down signal without introducing thermal oscillations. The working principle of thermal protection circuit was described, the circuit was designed based on BiCMOS 0.5 μm process library model of vanguard international semiconductor company. The simulation results used the Hspice software and based on BiCMOS 0.5 μm process library model of vanguard international semiconductor company show that the thermal protection circuit output reverses to shut down the other circuits on the chip when the ambient temperature reaches 137 ℃ , and reduced the power consumption and the temperature of the chip. When the temperature drops to 120 ℃ , the chip return to normal working condition, the amount of temperature hysteresis is 17 ℃ , the performance of the chip is stable and reliable.