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聚硅氧烷型交联剂的制备及其在聚合物多孔材料中的应用
  • ISSN号:1000-3851
  • 期刊名称:《复合材料学报》
  • 时间:0
  • 分类:TQ311[化学工程—高聚物工业]
  • 作者机构:[1]湖北大学有机化工新材料湖北省协同创新中心,武汉430062, [2]湖北大学材料科学与工程学院,武汉430062
  • 相关基金:国家自然科学基金(51203047)
中文摘要:

为了获得性能优异的聚合物多孔材料,首先,在封端剂六甲基二硅氧烷(MM)的存在下,通过硅酸钠与甲基丙烯酰氧基丙基三甲氧基硅烷(MPS)的水解缩聚反应制备了含甲基丙烯酰氧基丙基官能基团的MTQ有机硅树脂;然后,以MTQ硅树脂为交联剂,丙烯酸异辛酯(EHA)为单体,利用高内相比乳液模板法制备了MTQ硅树脂/聚丙烯酸异辛酯(PEHA)聚合物多孔材料;最后,对该多孔材料的孔结构、压缩性能和热稳定性进行了研究。结果表明:采用MTQ硅树脂作为交联剂制备得到的MTQ硅树脂/PEHA聚合物多孔材料的泡孔孔径介于4-10μm范围内,毛孔孔径分布于0.3-2.0μm区间内;泡孔之间紧密相连,毛孔均匀分布且通道较窄。MTQ硅树脂含量对MTQ硅树脂/PEHA聚合物多孔材料的比表面积和孔容的影响较小,但可显著提高聚合物多孔材料的热稳定性和压缩强度;在氮气氛围下,聚合物多孔材料的最大热分解速率温度可达411.5℃。

英文摘要:

In order to obtain the polymer porous materials with excellent performances,under the existence of endcapping reagent hexamethyldisiloxane(MM),MTQ organic silicone resin with methacryloxypropyl functional group was prepared by hydrolytic condensation polymerization reaction between sodium silicate and methacryloxypropyltrimethoxylsilane(MPS)firstly.Then,the MTQ silicone resin was used as crosslinking agent and 2-ethylhexyl acrylate(EHA)was used as monomer,MTQ silicone resin/poly 2-ethylhexyl acrylate(PEHA)polymer porous materials were prepared by high internal phase emulsions template method.Finally,the pore structure,compressive properties and thermal stability of the porous materials were investigated.The results show that the voids diameter of MTQ silicone resin/PEHA polymer porous materials prepared by using MTQ silicone resin as crosslinking agent is in the range of 4-10μm,and the pores diameter distributes in the range of 0.3-2.0μm.All of the voids are linked closely,the pores are uniform distributed and the channels are narrow.MTQ silicone resin content has little effects on the specific surface area and pore volume of MTQ silicone resin/PEHA polymer porous materials,but can enhance the thermal stability and compressive strength of polymer porous materials significantly,the temperature of maximum thermal decomposition rate is up to 411.5 ℃ under nitrogen atmosphere.

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期刊信息
  • 《复合材料学报》
  • 中国科技核心期刊
  • 主管单位:工业和信息化部
  • 主办单位:北京航空航天大学 中国复合材料学会
  • 主编:益小苏
  • 地址:北京海淀区学院路37号
  • 邮编:100083
  • 邮箱:
  • 电话:010-82316907
  • 国际标准刊号:ISSN:1000-3851
  • 国内统一刊号:ISSN:11-1801/TB
  • 邮发代号:80-413
  • 获奖情况:
  • 国内外数据库收录:
  • 被引量:17731