中文摘要：

建立了单颗粒以及嵌片式复合的有限元模型,发现较小的极间间隙、适当加工电压以及工艺流程能够达到较好的抛光效果。实验验证,一次复合抛光加微量进给或不进给的纯机械反向磨削的工艺,能够获得表面粗糙度0.5μm左右的加工表面。

英文摘要：

This paper established Finite Element Model of a single grain and embedded chip compound,it found smaller gap、appropriate voltage、process flow which were able to achieve a good polishing effect.The results show that a compound polishing with micro-feed or purely mechanical grinding without feed all can get the surface roughness around 0.5μm.