中文摘要：

研究了Sn-3Ag/Cu钎焊接头在液相钎焊和固相时效后界面金属间化合物（IMC）的生长行为和晶体取向.实验结果表明,液相反应和固相反应生成的IMC形貌差别很大;液相钎焊时IMC生长与时间的0.4次方成正比,而在固相时效时IMC生长与时间的平方根成正比,其生长激活能为90kJ/mol;通过液固晶体取向对比,发现液态钎焊和固相时效中晶体取向没有明显变化.

英文摘要：

The growth behavior and crystal orientation of intermetallic compound layers (IMC) in Sn-3Ag/Cu joints during soldering and isothermally aging have been investigated. The Sn-3Ag/Cu joints were soldered and aged for various time and then were examined by SEM and SRD. The experimental results indicate that the morphology and microstructure of IMC change significantly during both soldering and aging processes. The thickness of IMC is found to increase linearly with time0.4 (t0.4) in soldering process, while it increases linearly with time1/2 (t1/2) in aging process with activation energy for IMC growth of about 90 kJ/mol. The XRD analysis shows that the crystal orientation of IMC layer after soldering is similar to that after aging.