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Effect of hydrogen-doping on bonding properties of Ti3SiC2
  • ISSN号：0921-4526
  • 期刊名称：Physica B: Condensed Matter
  • 时间：2011.12.1
  • 页码：4460-4465
  • 相关项目：氢氦对辐照材料损伤机制的计算机模拟研究
作者： Shi, L. Q.|Ding, W.|Wang, M.|Zhu, Y. S.|
同期刊论文项目
氢氦对辐照材料损伤机制的计算机模拟研究
期刊论文 14 会议论文 1
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