中文摘要：

为进一步提高大面积平面电铸件厚度分布的均匀性,提出一种改进型电铸工艺——阴极加设＂回＂字型屏蔽板并做周向等幅平面运动,并对此进行了数值分析与实验研究。研究结果表明：＂回＂字型屏蔽板结构参数与位置参数对阴极电流密度分布有很大影响,采用改进型电铸工艺能显著改善电铸层厚度的分布特性,基于新工艺制备约为100μm厚的电铸层（大小70 mm×70 mm）的厚度差小于8%.

英文摘要：

A modified electroforming approach is proposed to further improve the thickness uniformity of electroformed pieces with large areas. The proposed approach involves the addition of a hollow square cathode-shielding plate to the cathode which translates circumferentially. Some simulations and experi- ments were carried out to study the proposed method. The research results show that both geometrical fea- ture parameters and placement positions of hollow square cathode-shielding plate have great effects on the cathode current density distribution. The thickness distribution of deposited metal can be significantly im- proved using the modified process in which thickness deviation of less than 8% is achieved for 100 i~m thick deposit （70 mm x 70 mm）. The proposed electroforming approach is expected to provide an upgra- ded alternative for preparing the considerably uniform large-area fiat electroformed layers.