中文摘要：

采用电镀的方法在Cu基板沉积4μm厚Sn层作为钎料,在不同参数下对双钎料Cu/Sn＋Sn/Cu三明治结构进行钎焊连接,得到可形成全Cu_3Sn焊点的最优工艺参数组合为：Ar气保护下300℃,3 h,1 N。然后研究了全Cu3Sn焊点形成过程中不同金属间化合物（Cu_6Sn_5和Cu_3Sn）的生长形貌和界面反应机理。结果表明,钎焊10 min后在Cu-Sn界面形成了扇贝状的Cu_6Sn_5,并且在Cu基板与Cu_6Sn_5之间有一层很薄的Cu_3Sn出现,Cu/Cu_3Sn和Cu3Sn/Cu_6Sn_5界面较为平整。随着时间延长,上下两层Cu6Sn5相互接触并融为一体,直至液态Sn完全被消耗,而Cu_3Sn通过消耗Cu_6Sn_5而快速增长,直到界面区全部形成Cu_3Sn。

英文摘要：

Electroplating was used to deposit a 4 μm thick Sn layer on the Cu substrate. Cu/Sn＋Sn/Cu sandwich structure was soldered under different parameters in order to fabricate Cu/Cu3Sn/Cu solder joints. It is found that the joints soldered at 300 ℃ with 1 N pressure and 3 h argon protection are completely composed of Cha/Cu3Sn/Cu. Then the growth morphologies of IMCs and the mechanism of different interfaces formation were analyzed. The results show that there is scallop-like Cu6Sn5 formed at the Cu-Sn interface after being soldered for 10 mins and a thin CuaSn layer is formed between Cu and Cu6Sns. The interfaces of Cu/Cu3Sn and Cu3SrdCu6Sn5 are flat. Cu6Sn5 at the two original boundary planes connect with each other with the increases of soldering time. When the liquid Sn is totally consumed, there is no new Cu6Sn5 formed. Meantime, Cu3Sn increase quickly at the expense of consumed Cu6Sn5 until Cu6Sn5 are totally transformed into Cu3Sn.