介绍了用于制备薄膜材料的磁控溅射技术,总结了以改变磁场分布方式而得到的各类新型磁控溅射方式,如非平衡磁场(扩散性、内敛性、闭合场),扫描磁场,强度可变磁场,在基片、靶面或其他部位外加的磁场,高强度磁场等。
In this paper,magnetron sputtering technology is introduced. Several different sputtering technologies based on changing the distribution of magnetron field are concluded,such as unbalanced magnetic system (dispersive, converged,closed fields), scanning magnetic field, changeable magnetic field, extra magnetic fields added on substrate, target or somewhere else, strong magnetic field, etc.