中文摘要：

对采用不同粒度配比和热压制备的W-Cu梯度功能材料的热物理性能进行研究。结果表明：梯度材料的整体热导率较高，达到226．4W／（m·K），高于过渡层W／Cu33的热导率，低于散热层W／Cu50的热导率；封接层具有低的线性热膨胀系数，αRT-100℃=6．82×10^-6／℃，满足与BeO基板材料封接匹配的要求；低温热压条件下制备的W-Cu梯度功能材料各梯度层的热膨胀系数具有良好的可控性和可设计性能，其实测值与理论值十分接近，其误差值低于6％；耐热冲击温度达到800℃以上，热疲劳性能可达500℃水淬50次以上。

英文摘要：

The thermo-physical properties of W-Cu functionally gradient materials fabricated by the method of particle size adjustment combining with hot press were investigated. The results show that the W-Cu functionally gradient material has a high thermal conductivity as 226.4 W/（m.K）, which is higher than that of the transitional layer W/Cu33 and lower than that of the radiating layer, W/Cu50. The sealing layer has a low coefficient of thermal expansion （CTE）, αRT-100℃ = 6.82× 10^-6/℃ which can match well with the substrate BeO. The CTE of each graded layer by this method has good lesignability. The experimental value is close to the theoretical value, with error lower than 6%. The thermal shock temperature is higher than 800℃ and the thermal fatigue property is more than 50 times by quenching at 500 ℃.