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Modeling of Micropitch Shift of a Magnetoelectrical Sensor During Laser Solder Ball Bonding Process
  • ISSN号：1521-3323
  • 期刊名称：IEEE Transactions on Advanced Packaging
  • 时间：0
  • 页码：136-145
  • 语言：英文
  • 相关项目：含有限晶粒的电子封装微连接接头的微观力学行为
作者： Yanhong Tian|Chunqing Wang|Dewen Tian|
同期刊论文项目
含有限晶粒的电子封装微连接接头的微观力学行为
期刊论文 8 会议论文 7 专利 1
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