中文摘要：

A two-dimensional linear spring model is established to study themicrobuckling of a plane monomolecular layer adhering to a substrate. The modelis for the layer subjected to a compressive load having an arbitrary angle with thechemical bond of the layer. The effects of the load angle, the strength of adhesionand the bending stiffness and shearing stiffness (the capability of resisting transversebending and in-plane shearing) of the layer on the minimal buckling force and thecritical buckling mode are discussed. It is found that the minimal buckling forceincreases with increasing load angle and, for a given bending stiffness, increases withincreasing strength of adhesion and decreasing shearing stiffness. Furthermore, acritical condition under which the buckling of the layer can just occur is obtained,which is helpful to avoid buckling in an engineering application.

英文摘要：

A two-dimensional linear spring model is established to study the microbuckling of a plane monomolecular layer adhering to a substrate. The model is for the layer subjected to a compressive load having an arbitrary angle with the chemical bond of the layer. The effects of the load angle, the strength of adhesion and the bending stiffness and shearing stiffness (the capability of resisting transverse bending and in-plane shearing) of the layer on the minimal buckling force and the critical buckling mode are discussed. It is found that the minimal buckling force increases with increasing load angle and, for a given bending stiffness, increases with increasing strength of adhesion and decreasing shearing stiffness. Furthermore, a critical condition under which the buckling of the layer can just occur is obtained, which is helpful to avoid buckling in an engineering application.