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Quick System-Level DDR3 Signal Integrity Simulation Research
  • ISSN号:1674-862X
  • 期刊名称:《电子科技学刊:英文版》
  • 分类:TP309[自动化与计算机技术—计算机系统结构;自动化与计算机技术—计算机科学与技术] TH-39[机械工程]
  • 作者机构:[1]College of Electronic Information Engineering, Inner Mongolia University, Hohhot 010021, China, [2]PC Client Group, Intel Asia-Pacific R&D Ltd., Shanghai 200000, China
  • 相关基金:This work was supported by the National Natural Science Foundation of China under Grant No. 61161001.
中文摘要:

Double data rate synchronous dynamic random access memory(DDR3) has become one of the most mainstream applications in current server and computer systems.In order to quickly set up a system-level signal integrity(SI) simulation flow for the DDR3 interface,two system-level SI simulation methodologies,which are board-level S-parameter extraction in the frequency-domain and system-level simulation assumptions in the time domain,are introduced in this paper.By comparing the flow of Speed2000 and PowerSI/Hspice,PowerSI is chosen for the printed circuit board(PCB) board-level S-parameter extraction,while Tektronix oscilloscope(TDS7404) is used for the DDR3 waveform measurement.The lab measurement shows good agreement between simulation and measurement.The study shows that the combination of PowerSI and Hspice is recommended for quick system-level DDR3 SI simulation.

英文摘要:

Abstract---Double data rate synchronous dynamic random access memory (DDR3) has become one of the most mainstream applications in current server and computer systems. In order to quickly set up a system-level signal integrity (SI) simulation flow for the DDR3 interface, two system-level SI simulation methodologies, which are board-level S-parameter extraction in the frequency-domain and system-level simulation assumptions in the time domain, are introduced in this paper. By comparing the flow of Speed2000 and PowerSI/Hspice, PowerSI is chosen for the printed circuit board (PCB) board-level S-parameter extraction, while Tektronix oscilloscope (TDS7404) is used for the DDR3 waveform measurement. The lab measurement shows good agreement between simulation and measurement. The study shows that the combination of PowerSI and Hspice is recommended for quick system-level DDR3 SI simulation.

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期刊信息
  • 《电子科技学刊:英文版》
  • 主管单位:
  • 主办单位:电子科技大学
  • 主编:周小佳
  • 地址:成都市建设北路
  • 邮编:610054
  • 邮箱:journal@westc.edu.cn
  • 电话:028-83200028
  • 国际标准刊号:ISSN:1674-862X
  • 国内统一刊号:ISSN:51-1724/TN
  • 邮发代号:62-268
  • 获奖情况:
  • 第二届中国高校特色科技期刊奖
  • 国内外数据库收录:
  • 美国化学文摘(网络版),英国科学文摘数据库,英国高分子图书馆,瑞典开放获取期刊指南
  • 被引量:6