中文摘要：

可逆粘附是转移印刷中转印头重要的特性，在最近的实验中通过控制接触面实现可逆粘附．通过外加压力控制转印头的塌陷和其与基体的接触面使界面的粘附力达到3个量级的转换．建立的力学模型研究了在外压作用下转印头的塌陷和接触面积，接触面积与外压及长高比的关系对转印头的设计很有帮助．

英文摘要：

Reversible adhesion is an important feature of stamp for transferring printing, and it is realized in recent experiments by controlling the contact area. Compression leads to stamp collapse, and controls the contact area to change the adhesion strength by 3 orders of magnitude. Mechanics models are developed to determine the stamp collapse and contact area under compression. The contact area for the external load and aspect ratio are obtained, and the finding is very useful for stamp design.