中文摘要：

通过有机镀膜的方法，利用一种自设计合成的三嗪硫醇化合物（TTN）在铜表面制备有机薄膜。通过循环伏安法解释了TTN在纯铜表面的反应及有机薄膜（PTT）的生长过程，并在0．05mA／cm^2的电流密度下进行恒电流有机镀膜。通过电化学方法对薄膜的性能进行了评价，测试结果显示有机镀膜方法能在铜表面获得均匀致密的有机膜，为有机介电薄膜的制备提供研究基础。

英文摘要：

A designed organic compound of triazine thiols monosodium （TTN） was used for preparing polymeric film （PTT） on pure copper by polymer plating. Cyclic voltammetry was used to study the reaction and film growth process of PTT film on the surface of pure copper. The film was fabricated by means of glvanostatic method under the current density of 0.05mA/cm^2. Electrochemical measurements were applied to evaluate the performance of the polymeric film on copper surface. The results showed that the homogeneous, compact film could be obtained by polymer plating. This work can be the basic research for the preparation and analysis of polymeric dielectric film on pure copper surface.