中文摘要：

微尺度传热是近几年来发展起来的一种重要传热技术，广泛应用于高集成度的电子器件的冷却。大功率半导体激光器的热沉积是限制其性能发挥和功率进一步提高的瓶颈。本文研究的热沉用于冷却一种以半导体激光条阵列为泵浦的大功率激光器，其10mm×1mm半导体激光条表面的热流密度高达400W／cm^2。本文对以无氧铜为材料、以水为冷却介质的微通道热沉的结构尺寸进行了优化设计。结果表明，热沉结构对热阻、泵功、半导体激光条表面温度分布有重要影响，其中微通道进出口宽度对泵功的影响最大。

英文摘要：

The microscale heat transfer is an important cooling technique developed in recent years and applied widely to cool the Large Scale Integrated Circuit. The heat accumulation is a bottleneck for increasing the power of laser systems, for example, the heat flux can sometimes reach 400 W/cm^2 on the surface of a 10 mmxl mm diode laser bar. In the paper the structure of a copper heat sink for cooling high-power diode laser bar is optimized. Water is used as a coolant. The result shows that the structure of microchannel heat sink is important to affect the thermal resistance, pump power and temperature distribution on the surface of high-power diode laser bar. And the most important effect on the pump power is the width of the microchannel inlet and outlet.