中文摘要：

通过有限元模型模拟划痕试验得到的结果表明∶切应力的起伏变化、膜/基界面处切应力差值、接触区附近膜层表面张应力、高载下的几种应力集中等,对膜/基体系的失效都有重要的作用.通过模型计算临界载荷下的膜/基界面处切应力差值,可用来评价膜层与基材的结合强度;提出了划痕试验中膜/基体系失效的2种机制.不同性能基材的TiN膜/基体系划痕试验结果,可验证本文有限元模拟的有效性,并表明临界载荷是膜/基结合强度、体系承载能力、内聚结合性能等的综合反映;低载往复摩擦磨损试验的结果进一步证实,用划痕试验的临界载荷评估膜/基结合强度具有局限性.

英文摘要：

The finite element simulation for scratching test showed that undulant variation of shear stress,difference of shear stress at interface of film/substrate,surface tensile stress around contact region,several concentrations under high loading etc. played important roles on failure of film/substrate. The difference of shear stress between film and substrate near interface,which was calculated by the FEM simulation at critical load of scratching test,could be used as a criterion for estimating adhesive strength. Two mechanisms of failure of film/substrate system in scratching test have been suggested. The validity of the FEM simulation has been confirmed by the result of scratching test to TiN film deposited on different substrate. The critical load resulted from synthetic effect of film/substrate system performance,such as adhesion strength,load bearing capacity,cohesion strength. The limitation of estimating adhesive strength of film/substrate by critical load in scratching test further proved by results of friction and wear test in reciprocating sliding under low loading.