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中文摘要：
通过热压扩散复合制备钛-铜复合板,研究了温度对复合界面形貌的影响.SEM分析表明扩散界面由Cu4Ti、Cu4Ti3、CuTi、CuTi2化合物相组成,同时存在2个不同衬度的Cu4Ti相层.复合板的导电性得到大幅提高,是纯钛的13.2～15.7倍.
英文摘要：
The Ti-Cu composite plates were fabricated by hot-pressing-diffusion compounding technology,and the effects of temperature on the interface morphology were investigated using scanning electron microscope（SEM）.It was found that the diffusion layers consisted of Cu4Ti、Cu4Ti3、CuTi、CuTi2,and there were layers of Cu4Ti with different contrast.The conductivity of the Ti-Cu composites was as high as 13.2 to 15.7 times that of the pure Ti.
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