有层的 Nano-ring-type 磁性的隧道连接( NR-MTJs )组织 ofTa ( 5 )/Ir_( 22 )Mn_( 78 )( 10 )/Co_( 75 )Fe_( 25 )( 2 ) /Ru ( 0.75 )/Co_( 60 )Fe_( 20 )B_( 20 )( 3 ) /AI ( 0.6 ) -oxide/Co_(60)Fe_(20)B_(20)(2.5)/Ta(3)/Ru(5)(thickness unit:nm )在磁控管劈啪作响免职与光平版印刷术,电子 beamlithography ( EBL )和蚀刻 techniques.The 的 Ar 离子横梁相结合的 Si ( 100 ) /SiO2 substrateusing 上是 制作nano 的有约 50 和 100 nm 并且也的 inner-andouter-diameter 的更小的 NR-MTJs 他们的 corres
Nano-ring-type magnetic tunnel junctions (NR-MTJs) with the layer structure of Ta(5)/Ir22Mn78(10)/ Co75Fe25(2)/Ru(0.75)/CoooFe20B20(3)/Al(0.6)-oxide/Co60Fe20B20(2.5)/Ta(3)/Ru(5) (thickness unit: nm) were nano-fabricated on the Si(100)/SiO2 substrate using magnetron sputtering deposition combined with the optical lithography, electron beam lithography (EBL) and Ar ion-beam etching techniques. The smaller NR-MTJs with the inner- and outer-diameter of around 50 and 100 nm and also their corresponding NR-MTJ arrays were nano-patterned. The tunnelling magnetoresistance (TMR & R) versus driving current (I) loops for a spin-polarized current switching were measured, and the TMR ratio of around 35% at room temperature were observed. The critical values of switching current for the free Co60Fe20B20 layer relative to the reference Co6oFe2oB2o layer between parallel and anti-parallel magnetization states were between 0.50 and 0.75 mA in such NR-MTJs. It is suggested that the applicable MRAM fabrication with the density and capacity higher than 256 Mbit/inch2 even 6 Gbite/inch2 are possible using both I NR-MTJ+1 transistor structure and current switching mechanism based on based on our fabricated 4×4 MRAM demo devices.