欢迎您！东篱公司
退出
-
申报数据库
-
立项数据库
-
成果数据库
-
项目获奖数据库
中文摘要：
结合Marom模型与实验数据,给出了晶粒尺寸与金属薄膜厚度的关系式.基于已有的理论模型,针对厚度为10-50 nm Cu薄膜,考虑到表面散射与晶界散射以及电阻率晶粒尺寸效应,提出一种简化电阻率解析模型.结果表明,在10-20 nm薄膜厚度范围内,考虑晶粒尺寸效应后的简化模型与现有实验数据符合得更好.相对于Lim,Wang与Marom模型,所提模型的相对标准差分别降低74.24%,54.85%,78.29%.
英文摘要：
A relation between grain size and metal film is given by combining the Marom model with experiment data.Based on available theory model,taking into account the surface scattering,boundary scattering and grain size effect,an analytical resistivity model is presented for the 10-50 nm thick Cu films.In particular,within a range of 10-20 nm,the findings show that the proposed model with consideration of grain size effects is in good agreement with experimental results.Compared with Lim,Wang and Marom＇ models,the proposed method can reduce the relative standard deviations by 74.24%,54.85%and 78.29%,respectively.
同期刊论文项目
同项目期刊论文
An interconnecting bus power optimization method combining interconnect wire spacing with wire order
期刊信息
位置：