XeF2是一种可以在常温下与硅发生反应的气体,可用作对硅进行干法刻蚀的工作气体,其对硅刻蚀特性呈现各向同性.研制了一个使用脉冲法对二氧化硅/硅体系进行XeF2刻蚀的系统,刻蚀系统简单且操作容易.利用该系统成功地刻蚀出“蘑菇状”的SiO2/Si结构,得到的刻蚀选择比大于1000.
XeF2 can react with silicon in room temperature and be kind of isotropie dry etching. A XeF2 pulse etching system with used as silicon dry etching gas, it is a simple structure and easy operating has been constructed to perform SiO2/Si etching. With this system, the mushroom like SiO2/Si structure has been fabricated, and the etching selectivity between silicon and silica mask exceed 1 000.