中文摘要：

利用ANSYS有限元分析软件对石墨/铜机械连接传热效果、适配层对钨/铜第一壁材料界面行为改善及结构优化进行研究.结果显示,除螺钉固定区域外,石墨/铜两种机械连接方式能够承受4 MW/m^2的热负荷作用.但是对于较高的热负荷区域,机械连接是不适合的.适配层的引入能有效降低钨/铜界面的热应力集中,特别是钨/铜适配层,而对温度抬高较小.0.1～0.2 mm、20％～30％W/Cu（体积分数）是1 mm钨涂层最佳的适配层结构,能有效降低表面热应力（高达24％）。

英文摘要：

The heat transfer performance of doped graphite jointed to copper was analysed by ANSYS code.Meanwhile,the optimization of tungsten/copper plasma facing component with the different compliant layers was carried out.The results indicated the doped graphite/copper can withstand the heat flux of 4 MW/m^2,especially for Joint_2,which can avoid the plasma irradiation on the screw-fastened region,is the more suitable joint structrue.But under the higher heat flux,mechanical joint was not acceptalbe.The compliant layers of Ti,NiCrAl,and W/Cu between W and Cu can obviously reduce the interface stresses,especailly for W/Cu.However,the surface temperature increased less.Further investigation found that 0.1-0.2 mm,20%-30% W/Cu is the optimum structure for 1 mm W PFM,which can reduce the peak stress of about 24%.