中文摘要：

目的：比较不同材质粘结体和粘结基底对剪切强度测试值的影响。方法：设计粘结体与基底的5种不同组合方式（瓷基底一瓷粘结体，树脂基底一瓷粘结体，瓷基底一树脂粘结体，瓷基底一预固化树脂粘结体，瓷基底一树脂水门汀粘结体），分别采用2种树脂水门汀系统（PanaviaF，Kuraray／Biscem，BISCO）将粘结体与基底粘结在一起制成剪切测试样本，并采用聚乙烯薄膜将粘结面积限定为直径2、4、6mm的圆孔，共分为30个实验组，每组8个样本。在万能实验机上测定各样本的剪切粘结强度；体视显微镜（SMZ645）观察粘结破坏模式。结果：粘结体为瓷质的剪切强度值显著高于其他组（P〈0．05），不同粘结基底材质对剪切强度值无显著影响（P〉0．05）。随粘结面积减小，剪切强度值提高（P〈0．05）。相同粘结面积组中，剪切强度较高的实验组发生混合破坏和内聚破坏的样本较多；较小粘结面积的实验组虽然获得了较高的粘结强度值，但更多地表现为粘结界面破坏。结论：粘结体和粘结基底的材质以及粘结面积对剪切强度测定值均有明显影响。在剪切粘结强度实验中，须根据所模拟的临床对象选择合适的粘结体与基底材料。

英文摘要：

AIM： To investigate the influence of different adherend and different substrate materials on shear bond strength. METHODS： 5 types of substrate base and adhesive system combination（ceramic and ceramic ad herend, resin and ceramic adherend, ceramic and resin adherend, ceramic and precuring resin adherend, ceramic and resin cement adherend, ceramic and resin cement adherend） were prepared. Two dual-curing resin cement systems （Panavia F, Kuraray/Biscem, BISCO） were respectively applied with different bonding dimension （2, 4 and 6mm of diameter） for each combination. The shear bond strength （SBS） of the samples in the 30 groups （n = 10） was meas ured. The failure modes were examined by stereomicroscope（ SMZ645 ）. RESULTS： Samples of both adhesive systems and all three dimensions with ceramic adherend showed higher SBS values （P 〈 0.05）. The substyate material showed no influence on the SBS value（P 〉 0.05）. For any adhesive system or adherend, the samples with smaller bonded di mension showed higher SBS values （P 〈 0.05 ）. With the same dimension, the groups of higher SBS values showed more mixed or cohesive failures. Nevertheless, for any combioation, the samples with smaller dimension and higher SBS values intended to have more interfacial failures. CONCLUSION： Various materials of adherend and substrate will influence the SBS value in vitro.