利用直流磁控溅射在SiO2/Si双层基底上制备厚度为60 nm的银纳米晶体薄膜,使用纳米压痕仪对其进行压痕,使用原子力显微镜对压痕区域进行形貌表征,将压痕后的银薄膜转移到透射电子显微镜中观察研究微结构变化。结果表明,压痕区域呈正三角形,边缘有堆起现象;压痕前沉积态薄膜的晶粒较小呈等轴状,压痕后晶粒较大一般呈条带状,长度方向垂直于压痕边缘;压痕区域内的晶粒内出现了大量的形变孪晶,孪晶方向一般亦垂直于压痕边缘。
Silver nanocrystalline film with a thickness of 60 nm was deposited on SiO2/Si substrate by DC magnetron sputtering.Nanoindentation tests were performed on the silver film.Atomic Force Microscope was utilized to characterize morphology of the indentation area.The film with the indented area was transferred into Transmission Electron Microscope for further investigation.The results showed that the indented area had a shape of triangle and pile-up was observed along the indentation edge.After the indentation,smaller equi-axial grains of the silver thin film became larger ones whose length direction was perpendicular to the triangle edge.Plenty of deformation twins whose direction was perpendicular to the indentation edge were introduced into the indentation area.