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Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes
  • ISSN号：2156-3950
  • 期刊名称：IEEE Transactions on Components Packaging and Manu
  • 时间：2014
  • 页码：560-568
  • 相关项目：柔性电子跨尺度喷印制造中动力学行为与多场调控
作者： Liu, Zunxu|Huang, Yongan|Chen, Jiankui|Yin, Zhouping|
同期刊论文项目
柔性电子跨尺度喷印制造中动力学行为与多场调控
期刊论文 74 会议论文 24 专利 35 著作 1
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