中文摘要：

采用高能球磨结合放电等离子烧结的方法制备0.5%、1.0%和2.0%的Al_2O_3弥散增强Cu基复合材料。研究Al_2O_3在Cu基体中的分布状态,以及对复合材料强度、硬度、导电性能和摩擦系数的影响。结果表明：弥散分布于晶界处的Al_2O_3颗粒导致复合材料的硬度和抗拉强度都提高,而伸长率、电导率降低和摩擦系数降低。1.0%Al_2O_3/Cu复合材料的相对密度达到98.22%、电导率为48.38 MS/m,硬度102.7 HV,抗拉强度264.97 MPa,摩擦系数0.28。

英文摘要：

In this paper,Al_2O_3 dispersion strengthened copper-based composites with mass fraction of 0. 5% 、1. 0%和 2. 0% were prepared by high-energy ball milling and spark plasma sintering. The distribution of Al_2O_3 and its effect on the strength,hardness,electrical conductivity and friction coefficient in the copper-based composite were studied. The results show that the hardness and tensile strength of composite were improved by the Al_2O_3 particles dispersed in the grain boundary,while the elongation,conductivity and friction coefficient were decreased. The relative density, electrical conductivity, hardness tensile strength and friction coefficient of 1. 0 % Al_2O_3/ Cu composite reached respectively 98. 22%,48. 38 MS / m,102. 7 HV,264. 97 MPa and 0. 28.