在钽合金微弧氧化陶瓷层表面电镀镍,分析了陶瓷层和镀镍层的形貌、成分组成及陶瓷层与镀镍层的结合情况,研究了陶瓷层表面有无镀镍层对浇铸时钽合金在熔融镍中防护作用的影响。结果表明:采用微弧氧化技术在钽合金表面制备的陶瓷层主要成分为Ta2O5,厚度可达30-35μm;采用PVD结合电镀的方法在陶瓷层表面制备的镍镀层厚度为20-30μm,且镀镍层表面致密,镀镍层与陶瓷层结合连续紧密;无镀镍层的钽合金试样在浇铸过程中受到熔融镍的作用后表面陶瓷层会开裂失效,导致基体与熔融镍发生反应,无法起到防护作用;有镍镀层的钽合金试样在受到熔融镍的作用后表面陶瓷层连续完整,镀镍层可以有效地防止陶瓷层开裂,显著提高陶瓷层对钽合金的防护作用。
Nickel was continuously plated via magnetron sputtering and electroplating on the surface of Ta-based alloy processed by micro-arc oxidation, and its effects on the protection of the ceramic scale formed on the surface of Ta-based alloy to molten nickel was investigated. Results show that the ceramic scale with a thickness of 30-35 μm prepared by micro-arc oxidation is mainly Ta2O5. Although the ceramic layer is continuous and bonds well to the alloy substrate, severe cracking and peeling occur when it contacts with the molten nickel during casting, which causes the reaction of the Ta-based alloy. Fortunately, the protection effect of the ceramic scale to molten nickel is greatly improved by the plated nickel layer with a thickness of 20-30 μm. The ceramic scale is still continuous and integrity after nickel casting. Thus, the nickel plating can be used as a protection coating for the ceramic scales on the Ta-based alloy prepared by micro-arc oxidation in molten nickel environments.