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Investigation of post-etch copper residue on direct bonded copper (DBC) substrates
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2011
  • 页码：2119-2125
  • 相关项目：高温功率电子封装用新型绿色芯片粘接材料的电迁移行为及理论研究
作者： Mei, Yunhui|Lu, Guo-Quan|Chen, Xu|Gang, Chen|Luo, Shufang|Ibitayo, Dimeji|
同期刊论文项目
高温功率电子封装用新型绿色芯片粘接材料的电迁移行为及理论研究
期刊论文 27 会议论文 6
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