中文摘要：

随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。为适应这种需求，除继续发展各种高性能芯片散热技术外，对整机系统的热管理进行总体部署及优化，以降低能耗及散热的成本。文中对近年来个人计算机（PC）及服务器应用中发展出的若干典型的系统级热管理技术进行了综合评述，并从散热方式、材料、结构及使用角度等方面提出了一些新的观点，剖析了其中的关键科学问题，对今后计算机散热技术的发展前景作了展望。

英文摘要：

With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years. To adapt to this situation, besides continuing the develop ment of various high-performance chip cooling technologies, deployment and optimization of computer thermal management from system-level, aiming to reduce power consumption and cooling costs, are becoming more and more necessary. In this article, a number of typical system-level thermal management technologies for personal computer and server are comprehensively reviewed. Some new viewpoints on cooling modality, material, structure and the utilization were presented. The key scientific issues are analyzed. Future prospects of developing advanced computer cooling technology are suggested.