采用高温磨损试验机对TC11合金进行了400~600℃高温干滑动磨损试验,研究了TC11合金的高温磨损行为和耐磨性;并通过X射线衍射分析仪(XRD)、扫描电镜(SEM)以及能谱分析仪(EDS)对磨面和亚表层的物相、形貌和成分进行分析,并探讨了磨损机制。在400℃下随着载荷增加磨损率略有增加,超过200 N时磨损率出现快速提高;当温度进一步提高至500~600℃时,磨损率降到最低,且不随载荷增加而变化。分析表明,在400℃时,磨面上出现塑性变形和撕裂的痕迹以及沿滑动方向的犁沟,同时出现致密的黑色光滑区和剥落区,磨损机制为黏着磨损、磨粒磨损和氧化轻微磨损。而在500~600℃,磨损表面均为致密的黑色光滑区和剥落区,且600℃时的剥落区小于500℃时的,磨损机制为氧化轻微磨损。亚表层分析表明,在高温下磨损表面均形成一层摩擦氧化物层,在400℃时摩擦氧化物层厚度为5~8μm,而在500~600℃,摩擦氧化物层增加到10~15μm,且摩擦氧化物层的致密度随温度增加而提高。摩擦层显示出高的硬度,可达到HV1000以上,而且随着温度增加,显微硬度显著增加。
Dry sliding wear tests were performed for TC11 alloy at 400 ~ 600 ℃ on a high-temperature wear tester. The wear behavior and wear resistance of TC11 alloy were studied. The phase, morphology and composition of worn surface and subsurface were examined by X-ray diffractometer (XRD), scanning electron microscope (SEM) and energy dispersion spectrometer (EDS), respectively. The wear mechanism was also explored. At 400 ℃, the wear rate slightly increased with the increase of load, and then rapidly increased as the load surpassed 200 N. When the temperature was elevated to 500 ~ 600 ℃, the wear rate decreased to the lowest and almost did not vary as the load increased. The results showed that the worn surface presented plastic deformation and fracture as well as furrow along the sliding direction, simultaneously there were dense black smooth regions and delaminated regions at 400 %. Adhesive wear, abrasive wear and oxidative mild wear prevailed. Dense black smooth regions and delaminated regions mainly appeared on worn surface at 500 ~ 600 ℃, while the delaminated regions at 600 ℃ were less than those at 500 ℃. The predominated wear mechanism was oxidative mild wear, Tribo-oxide layers appeared on worn surface at various temperatures. The tribo-layer reached about 5 ~ 8 p,m in thickness at 400 ℃, while it increased to 10 ~ 15 txm at 500 ~ 600 %. And the density of tribo-oxide layer increased with temperature increasing. The mi- crobardness of tribo-layer reached above HV1000. With the temperature increasing, the microhardness significantly increased.