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Micro Flat Heat Pipes for Microelectronics Cooling: Review
  • 期刊名称：Recent Patents on Mechanical Engineering
  • 时间：2013
  • 页码：169-184
  • 相关项目：环路热管蒸发器内汽液两相流动及传热的数值分析与实验研究
作者： Lu C Lv, J Li|
同期刊论文项目
环路热管蒸发器内汽液两相流动及传热的数值分析与实验研究
期刊论文 16 会议论文 9 专利 4
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