中文摘要：

采用静滴法对Sn-Zn,Sn-Ag-Cu,Sn-Bi-Cu锡基合金在铜基板上的润湿性进行了研究.结果表明,Sn-Bi-Cu合金的润湿性良好,Sn-30Bi-0.5Cu合金在530K时的接触角为26°,熔融的Sn-3Ag-0.5Cu共晶合金的接触角几乎不存在滞后性.锡基合金中添加Bi元素可提高合金的润湿性,添加Cu元素可有效防止溶铜发生.研究结果为无铅焊锡合金的应用提供了一定的理论依据.

英文摘要：

The wettability of Sn-Zn,Sn-Ag-Cu,Sn-Bi-Cu solder alloys on copper substrate was measured by sessile drop method.Among these solder alloys studied,the wettability of Sn-Bi-Cu alloy was excellent,at 530 K the contact angle between Sn-30Bi-0.5Cu alloy and Cu substrate was 26o.There was almost no contact angle hysteresis of the molten ternary eutectic Sn-3Ag-0.5Cu alloy.Adding Bi to Sn-based alloys could improve the wettability of alloys,while adding Cu could prevent the occurrence of dissolution of Cu substrate effectively.These research results may provide some theoretical basis for the use of lead-free solder alloys.