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中文摘要：
介绍了纳米级集成电路中软错误的发生机制、发展趋势以及评估技术，概括了软件、电路和体系结构以及工艺器件级软错误的缓解对策，并针对软错误问题相关研究的发展提出几点建议．
英文摘要：
This paper described the mechanism, trends and evaluation ter scale integrated circuits. For solving the soft error problems, the ures across the software level, circuit and architecture-level as well as suggestions on the development of related studies on soft error proble techniques of soft errors in nanome- paper summed up the countermeas- process device-level. At last, some ms were put forward.
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