中文摘要：

利用钛酸丁酯为原料，通过80℃下强迫水解的方法在微米级铜粉表面制备了TiO2光阴极保护涂层。XPS分析表明包覆铜粉的表面存在Cu^2＋,Ti^4＋，Sn^2＋元素，场发射扫描电镜观察表明，100nm左右的TiO2颗粒覆盖在铜粉表面形成纳米／微米复合结构。TG-DTA分析表明，原始铜粉在200℃开始氧化，而包覆铜粉在400℃以后才开始氧化。铜粉在酸性介质中的耐蚀性通过测定腐蚀溶液的Cu^2＋浓度来衡量，结果表明包覆铜粉的腐蚀失重远低于原始铜粉。在紫外和可见光照射下的浸蚀对比实验结果表明，紫外光照射能够加剧原始铜粉的腐蚀，而包覆铜粉由于表面TiO2的光阴极保护作用显示出良好的耐蚀性。

英文摘要：

TiO2 were prepared on the surface of copper particles of micron size by forced hydrolyses method at 80 degrees centigrade using tetrabutyl titanate as precursors. XPS analysis shows there exist Cu^2＋, Ti^4＋ and Snz^2＋ on the coated copper particle surfaces. SEM photos show TiO2 particles about 100nm are formed on the surface. TG-DTA thermal indicates copper particles are oxidized at 200 degrees centigrade, while the coated copper particles were oxidized at 400 degrees. Anti-corrosion properties were tested by measuring the concentration of Cu^2＋ in acid medium, and the results show that the concentration of Cu^2＋ of the coated copper particles is far lower than that of the original ones. Experiments of etching copper particles under UV and visible light primarily display the photo-cathodic protective effect of the TiO2 coatings.