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中文摘要：
微热管是高热流密度光电芯片领域广泛应用的高效热传导元件,抽真空和灌注是其性能的重要影响工序。通过分析目前微热管制造工艺中常用的抽真空灌注技术,提出灌注抽真空微热管制造技术;分析该技术的工作原理和二次除气理论,建立工质额外充液量、微热管工作死区、二次除气集气段长度等数学模型;对比分析抽真空灌注与灌注抽真空两种制造技术的特点;搭建微热管性能测试平台,对采用灌注抽真空技术制造的铜—水沟槽式微热管进行性能测试;对比研究引入额外充液量前后,灌注抽真空技术制造的微热管传热性能的差异,发现引入额外充液量后,微热管性能提高了12倍。试验结果表明灌注抽真空技术可以很好地满足微热管的制造需求。
英文摘要：
Micro heat pipe is an apparatus with high effective heat transfer efficiency for complementary metal oxide semiconductor （CMOS） chips which have high heat flux in a limited space, and its manufacturing technology of vacuuming and filling working fluid is critical for its quality. The conventional micro heat pipe manufacturing technology of first vacuuming then filling working fluid （FVFW） is analyzed, the manufacturing technology of first filling working fluid then vacuuming （FWFV） is proposed. The principle of the technology and the theory for second vacuuming are analyzed. Furthermore, Mathematical models are established, including the additional liquid inventory, the volume of work dead zone and the length of non-condensable gas. Comparison between FWFV and FVFW is investigated. Some copper-water grooved-wick micro heat pipes which are fabricated by FWFV are tested to validate FWFV. It shows that the performance of the micro heat pipe with additional liquid inventory improves 12 times that of without additional liquid inventory. Therefore, the micro heat pipe manufacturing technology of FWFV can manufacture micro heat pipes successfully.
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